Method for separating semiconductor substrate
US7550367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | May 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68336
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by irradiating a laser beam from at least one of a first side of the semiconductor substrate having the implementation member and a second side that is an opposite side of the first side of the semiconductor substrate along the separation line with a focusing point of the laser beam aligned with a substance in the semiconductor substrate and severing/removing at least one semiconductor chip at the separation line from the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.