Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material
US7550513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Dec 8, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/773
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is to provide fine particles of copper, nickel or palladium hydride having an average particle diameter of at most 50 nm, which are hardly oxidized in the atmosphere and are excellent in storage stability and are thereby very suitable for formation of metallic materials, and their production process. Further, it is to provide a dispersion containing fine particles of copper, nickel or palladium hydride, which is excellent in storage stability, and a metallic material obtained by applying the dispersion, followed by baking. The fine particles of copper, nickel or palladium hydride and the dispersion thereof, to be obtained by the present invention, are applicable to various applications, and they can be used for e.g. formation and repair of printed wiring, etc. employing a dispersion, interlayer wiring in semiconductor packages, and joining of printed wiring boards and electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.