Semiconductor device and voltage regulator
US7550837B2 · kind B2 · utility
14Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2006 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Feb 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.