Conductive bump with a plurality of contact elements
US7550846B2 · kind B2 · utility
3Cited by
6References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Dec 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.