Vertically spaced plural microsprings
US7550855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | May 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4092
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.