Led chip mounting structure and image reader having same
US7551329B2 · kind B2 · utility
3Cited by
9References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2003 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Nov 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED chip mounting structure provided by the present invention includes a wiring board with a mounting pad an LED chip with an electrode facing the mounting pad a bump disposed between the mounting pad and the electrode to electrically connect the mounting pad to the electrode and an adhesive member for fixing the LED chip to the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.