Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof
US7551443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2007 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Jul 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating module includes a heat pipe and a heat-dissipating device. The heat pipe has a first end, a second end and a partition pipe section. The first end is connected to a first heat-generating component. The second end is connected to a second heat-generating component. The diameter of the partition pipe section is different from the diameter of the first end. The heat-dissipating device is disposed on the heat pipe and is located between the first end and the second end. The heat-dissipating device includes a first heat-dissipating part and a second heat-dissipating part. The first heat-dissipating part is located between the first end and the partition pipe section for dissipating heat generated by the first heat-generating component. The second heat-dissipating part is located between the second end and the partition pipe section for dissipating heat generated by the second heat-generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.