Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry
US7551444B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Dec 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and computer processor system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry, such as, a high-performance cell processor complex, and a design structure on which the subject circuit resides are provided. The computer system includes predefined processor circuits including anti-tamper logic. A volume container substantially contains the predefined processor circuits including the anti-tamper logic. A heat spreader is provided with the predefined processor circuits within the volume container. An external heatsink structure is attached to an outside cover above the volume container. The heatsink structure includes a heatsink base and a plurality of parallel fins extending outwardly from the heatsink base. A heat pipe extending through a folded mesh is attached to the heat spreader within the volume container and is attached to the external heatsink base providing an effective heat removal path for the processor circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.