Thin-film assembly and method for producing said assembly
US7551454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2004 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0392
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film assembly (1) including a substrate (2) and at least one electronic thin-film component (8) applied on the substrate by thin-film technology, wherein a base electrode (4) is provided on the substrate, on which base electrode thin-film layers (21) forming part of the thin-film component are arranged together with an upper top electrode (9); the substrate (2) is comprised of a printed circuit board (2) known per se and including an insulation-material base body (3) and a metal coating as the conductor layer (5), wherein the conductor layer (5) forms the base electrode (4) and, to this end, is smoothed at least on the location of the thin-film component (8), and wherein a contact layer (18) is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer (5) and the superimposed thin-film layers (21) of the thin-film component (8), which contact layer is physically or chemically adsorbed on the surface of the base electrode (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.