Package structure
US7551455B2 · kind B2 · utility
3Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2006 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.