Method of manufacturing an integrated orifice plate and electroformed charge plate
US7552534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Sep 10, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An integrated orifice array plate and a charge plate is fabricated for a continuous ink jet print head by providing an electrically non-conductive orifice plate substrate having first and second opposed sides and an array of predetermined spaced-apart orifice positions. A plating seed layer is applied to the first of the opposed sides of the substrate, and an array of orifices is formed through the orifice plate substrate at the predetermined orifice positions. The orifices extend between the opposed sides. The plating seed layer is etched, leaving a portion of the plating seed layer adjacent to each of the predetermined orifice positions. A charge electrode is plated onto each of the portions of the plating seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.