Method for high-density packaging and cooling of high-powered compute and storage server blades
US7552758B2 · kind B2 · utility
20Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Aug 25, 2026 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/12
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.