Polishing composition
US7553345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2003 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Dec 18, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1409
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.