Method of altering the properties of a thin film and substrate implementing said method
US7553369B2 · kind B2 · utility
1Cited by
25References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jan 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for modifying the properties of a thin layer (1) formed on the surface of a support (2) forming a substrate (3) utilised in the field of microelectronics, nanoelectronics or microtechnology, nanotechnology, characterised in that it consists of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.