Method for covering a microfluidic assembly
US7553393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/2575
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for covering a set of open microchannel structures which are fabricated on a planar surface made of plastics and which comprise two or more part areas that have different surface characteristics. The method comprises the steps of: a) providing the surface comprising the set of microchannel structures; b) providing a lid-forming sheet having on one side an even layer of a thermoglue; c) applying the side of the sheet having the thermoglue against the surface carrying the microchannel structure; d) heating the assembly created in step (c) to selectively liquefy the hot-melt adhesive while at the same time pressing the sheet material and the planar surface of the substrate together; e) permitting the resulting laminate-covered microchannel structure to cool. An assembly comprising (a) a planar substrate, the surface of which has a set of one or more open microchannel structures each of which comprises part areas representing different functionalities, and (b) a lid-forming material covering said set of microchannel structures and having one or more openings going from a microchannel structure to ambient atmosphere. The assembly is characterized in that the joint between said …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.