Compression of resin impregnated insulating tapes
US7553438B2 · kind B2 · utility
4Cited by
66References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2005 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.