Heat mold device and a method of making a guide wire by using the same heat mold device
US7553444B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Apr 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5187
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
In a heat mold device 1 for a guide wire 9, the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coiled wire 91 to stabilize a shape-forming configuration 94. A plurality of the mold bodies 2 are arranged in a mold frame 6A to make the reverse side 22 of one mold body 2 tightly contact with the obverse side 21 of other mold body 2 among the neighboring mold bodies 2. A jig arm 7A sandwiches an array of metallic mold bodies 2 and the side plate 63 to serve as a securement member 7. Upon manufacturing the guide wire 9 well-suited to the medical field, the heat mold device 1 renders it possible to make a high quality guide wire with a high productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.