Method of manufacturing thin-film electronic device having a through-hole extending through the base and in communicative connection with an opening in the electrically conductive layer
US7553765B2 · kind B2 · utility
8Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/85
Abstract
A method of manufacturing a thin-film electronic device comprising providing a dielectric layer on a base, providing a first electrically conductive layer having a first opening and covering at least part of the dielectric layer; and forming a first through-hole extending through the base and communicating with the first opening. A second electrically conductive layer may be provided on the base, and a dielectric layer may be provided so as to cover at least part of this second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.