Substrate and a method for polishing a substrate
US7553768B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Apr 6, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.