Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition
US7553891B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2005 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Aug 2, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.