Electronic device
US7554039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2003 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jan 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.