Patent · US Active

Attachment system incorporating a recess in a structure

US7554177B2 · kind B2 · utility

9Cited by

7References

14Claims

0Family size

Assignee

AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. · SG

Inventors

Frank S. Geefay · Cupertino, US
David Dutton
Qing Bai · Shanghai, CN

Key dates

Filing date	Oct 5, 2005
Grant date	Jun 30, 2009
Priority date	—
Expiry date	Nov 10, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.