Patent · US Active

Semiconductor device

US7554186B2 · kind B2 · utility

2Cited by

2References

18Claims

0Family size

Assignee

SONY GROUP CORPORATION · JP

Inventors

Mamoru Kudo · Yokohama, JP
Kenichi Shigenami · Yokohama, JP
Shunichi Sukegawa · Ibaraki, JP

Key dates

Filing date	Apr 28, 2008
Grant date	Jun 30, 2009
Priority date	—
Expiry date	Apr 28, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a first semiconductor package, a second semiconductor package. The first semiconductor package includes a first semiconductor package base having a first cavity formed therein, a first mount component mounted in the first cavity, and a first magnet disposed on the first semiconductor package base. The second semiconductor package includes a second semiconductor package base having a second cavity formed therein, a second mount component mounted in the second cavity, and a second magnet disposed on the second semiconductor package base so as to adsorb the first magnet. The first semiconductor package and the second semiconductor package are stacked by an adsorption of magnetic force between the first magnet and the second magnet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.