Wireless communication module
US7554189B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2008 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Mar 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.