Liquid metal thermal interface material system
US7554190B2 · kind B2 · utility
12Cited by
26References
72Claims
0Family size
Inventors
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Oct 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.