Flexible joint methodology to attach a die on an organic substrate
US7554198B2 · kind B2 · utility
1Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Dec 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.