Direct facility water test head cooling architecture
US7554323B2 · kind B2 · utility
2Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2007 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.