Production test technique for RF circuits using embedded test sensors
US7554335B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Mar 23, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2856
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A single test stimulus and a simple test configuration with embedded envelope detectors are used to estimate all the specification values of interest for an RF circuit under test in an integrated circuit chip. Envelope detectors are deployed as sensors inside the circuit under test. Where more than one circuit is in an RF device in the integrated circuit, each RF circuit in the device may have its own envelope detector. A signal having, for example, time-varying envelopes is used as an optimized test stimulus. The test uses the time-varying and low frequency envelope of the test response. The circuit's response under test to the optimized test stimulus has features highly correlated with the specifications of interest. The test stimulus is optimized for a set of training circuits, and each training circuit in the set is selected to provide one of a spectrum of test responses to the stimulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.