Low temperature curable conductive adhesive and capacitors formed thereby
US7554793B2 · kind B2 · utility
50Cited by
8References
61Claims
0Family size
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Inventor
Key dates
| Filing date | Nov 16, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Apr 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/13
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved conductive adhesive and capacitor formed using the improved conductive adhesive. The conductive adhesive has: wherein: R is an aliphatic group of 1 to 10 carbons; wherein R3 is an alkyl or substituted alkyl of 1-10 carbons; and
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.