Heat dissipation structure for electronic devices
US7554805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 30, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.