Heat sink with thermoelectric module
US7554808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Apr 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.