Mounting apparatus for securing heat dissipation module to circuit board
US7554810B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2007 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Dec 29, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat dissipation module, and a plurality of support devices. Each support device comprises an enlarged flange portion, a support portion extending up from an upper surface of the flange portion, and a coupling portion extending down from a lower surface of the flange portion and detachably installable to a corresponding post, thereby suspending the heat dissipation module over the socket. A plurality of sleeve bodies is for respectively receiving the posts, and configured for being sandwiched between the corresponding flange portions and the circuit board. A plurality of fasteners extending from the mounting frame is engagable with the support portions respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.