Method for producing an optical splitter, and optical splitter

US7555176B2 · kind B2 · utility

Assignee

• CCS Technology Corporation · US

Inventors

• Franz Draxler · Dietramszell, DE
• Klaus Hartkorn · Corning, US
• Markus Meinelt · Dietramszell, DE
• Angela Rief · Munich, DE
• Wolfgang Gottfried Tobias Schweiker · Weyarn, DE

Key dates

• Filing date: Aug 22, 2007
• Grant date: Jun 30, 2009
• Expiry date: Aug 22, 2027

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/1215
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.