Thermosiphon for laptop computer
US7556088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Mar 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.