Mounting light emitting diodes
US7556405B2 · kind B2 · utility
18Cited by
27References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2006 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Jul 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.