Power electronic package having two substrates with multiple electronic components
US7557434B2 · kind B2 · utility
13Cited by
5References
36Claims
0Family size
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Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Oct 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the substrates. The substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions. The mechanical separation provides a net axially-directed compressive force in the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.