System and apparatus that reduce corrosion of an integrated circuit through its bond pads
US7557455B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2007 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Apr 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which could be formed by etching). Part of the first portion is exposed within a bond pad opening, and the second portion is electrically connected to an integrated circuit. The anti-reflective coating layer also includes first and second portions (which could be formed by etching). The first portion may be located near the bond pad opening, and the second portion may be located farther away from the bond pad opening. A second conductive layer electrically connects the first and second portions of the first conductive layer. In this way, the first portion of the anti-reflective coating layer may undergo oxidation without leading to oxidation of the second portion of the anti-reflective coating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.