Embedded circuits on an ultrasound transducer and method of manufacture
US7557489B2 · kind B2 · utility
8Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2007 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Jul 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One or more chips, integrated circuits, or semiconductors are embedded within a backing block. Planar sheets of backing material are formed with integrated circuits within holes in the sheets. Traces connect the integrated circuit to electrodes or exposed conductive surfaces. A plurality of the planar sheets may be manufactured using wafer processing, such as pick and place of chips in a wafer of backing material and IC redistribution for forming the traces. The different sheets are cut from the wafer and stacked adjacent each other. The transducer connects with the exposed electrodes or conductive surfaces of the backing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.