Electronic component package
US7557491B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2007 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Jul 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16315
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. The electronic component package 10 has a case 12 that has an opening and stores an electronic component (piezoelectric oscillator 11) in the storage inside, and a lid 16 that is joined to the rim of the opening to cover the opening, and airtightly seals a through-hole 20 provided on the bottom part 12b of the case 12 to communicate with the outside, by using a sealant 30. The electronic component package is provided with a shielding electrode 15 on the inner surface of the case to remove a noise influence, and further provided with a configuration to set a part (nonmetal part 22) between the through-hole 20 and the shielding electrode 15, the part being low in wettability with the melted sealant 30, thereby making it difficult to flow the melted sealant 30 from the through-hole 20 into the case 12 along the shielding electrode 15, preventing the melted sealant 30 from flowing into the case…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.