Cantilever microprobes for contacting electronic components and methods for making such probes

US7557595B2 · kind B2 · utility

Assignee

• Microfabrica Inc. · US

Inventors

• Richard T. Chen · Burbank, US
• Ezekiel J. J. Kruglick · San Diego, US
• Christopher A. Bang · San Diego, US
• Dennis R. Smalley · Santa Clarita, US
• Pavel B. Lembrikov · Santa Monica, US

Key dates

• Filing date: Oct 30, 2007
• Grant date: Jul 7, 2009
• Expiry date: Oct 30, 2027

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/06711
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.