Air guide with heat pipe and heat sink and electronic apparatus equipped with the same
US7558065B2 · kind B2 · utility
2Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2007 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Aug 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.