Method and system for drying semiconductor wafers in a spin coating process
US7559155B2 · kind B2 · utility
1Cited by
6References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 17, 2004 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Sep 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides methods and apparatus for drying the backside of semiconductor wafers in a spin-coating environment. Solvent is evaporatively dried from a semiconductor wafer held in a spin mechanism. The undried wafer is sprayed with one or more jets of pressurized gas from gas ports disposed about the spin mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.