Methods and apparatuses for implementing multi-via heater chips
US7559629B2 · kind B2 · utility
0Cited by
23References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Sep 29, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14072
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heater chip for use in a printing device that includes a first heater array with a left side and a right side and a first ink via placed on the left side of the first heater array. The chip also includes a second heater array with a left side and a right side, where a right side of the first heater array faces the left side of the second heater array, a second ink via placed on the right side of the second heater array, and at least one logic array is disposed between the first heater array and the second heater array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.