Sputtering target and method/apparatus for cooling the target
US7560011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Jul 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling plenum radially between the inner support tube and the outer target tube; and a baffle comprising a substantially flat plate attached to the inner support tube adjacent the opposite end, the plate extending radially within the plenum between the inner support tube and the outer target tube and having an array of flow apertures therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.