Thin film forming method and system
US7560038B2 · kind B2 · utility
1Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2004 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Feb 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film forming method, which includes the steps of: (1) holding at least one object in a chamber; (2) depositing a film-forming material on the object; (3) etching the forming material while depositing is conducted. In the present invention, the depositing and etching are controlled to simultaneously conduct. The invention also disclose a system for performing the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.