Fluid ejection device structures and methods therefor
US7560223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | May 15, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D15/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.