Method and apparatus for linear die transfer
US7560303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2006 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Dec 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53543
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.