Method for forming nanoscale features
US7560658B2 · kind B2 · utility
1Cited by
22References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/361
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Here is presented a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far below the wavelength of light, thus enabling nanomachining of a wide range of materials. The features may be extremely small (<20 nm) and are highly reproducible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.