Patent · US Active

Method for forming nanoscale features

US7560658B2 · kind B2 · utility

1Cited by
22References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 27, 2005
Grant dateJul 14, 2009
Priority date
Expiry dateApr 12, 2027

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/361
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Here is presented a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far below the wavelength of light, thus enabling nanomachining of a wide range of materials. The features may be extremely small (<20 nm) and are highly reproducible.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.