Heated pump with boiling protection
US7560672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2006 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Mar 31, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24H1/121
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heating system for heating fluid media including a carrier unit, a heating unit arranged on the carrier unit and a heat transfer element arranged on the carrier unit and includes a material which is a good conductor of heat, which heat transfer element has a first mounting portion for mounting a first safety device which responds at a first response temperature and a second mounting portion for mounting a second safety device which responds at a second response temperature which is lower than the first response temperature, which heat transfer element has a first temperature pickup portion which is in direct heat-conducting contact with the heating unit and the first safety device. The heat transfer element has a second temperature pickup portion is spatially separate from the first temperature pickup portion and in heat-conducting contact with the medium to be heated and the second safety device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.