Arrangement of semiconductor memory devices and semiconductor memory module comprising an arrangement of semiconductor memory devices

US7560807B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Hermann Ruckerbauer · Radolfzell, DE
• Holger Schroeter · Braunschweig, DE

Key dates

• Filing date: Dec 12, 2006
• Grant date: Jul 14, 2009
• Expiry date: Mar 29, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15192
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An arrangement of semiconductor memory devices includes a first semiconductor memory device and a second semiconductor memory device. The arrangement of semiconductor memory devices also has a flexible substrate. A first electrically conductive conductor track is arranged in the flexible substrate. At least one first contact of the flexible substrate is coupled to the at least one second contact of the second semiconductor memory device through the first electrically conductive conductor track. A second electrically conductive conductor track is arranged in the flexible substrate.